4 Patents
- US123947132025Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
Altera Corporation
0 cites - US123281252025Device, Method and System to Determine Calibration Information with a Shared Ring Oscillator Circuit
Altera Corporation
0 cites - US120092982024Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
Intel Corporation
0 cites - US116705892023Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
Intel Corporation
0 cites