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Chee Seng Foong
Austin, TX
US
2 patents
3 Patents
US12341089
2025
Device Package Substrate Structure and Method Therefor
NXP USA, Inc.
0 cites
US11908784
2024
Packaged Semiconductor Device Assembly
NXP USA, Inc.
0 cites
US11798871
2023
Device Package Substrate Structure and Method Therefor
NXP USA, Inc.
0 cites