Patents/Inventors

Chee Hong Lee

MelakaMY2 patents

3 Patents

US121762222024
Semiconductor Package with Metal Posts from Structured Leadframe
Infineon Technologies AG
0 cites
US119843922024
Semiconductor Package Having a Chip Carrier with a Pad Offset Feature
Infineon Technologies AG
0 cites
US117911692023
Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package
INFINEON TECHNOLOGIES AG
0 cites