Che-ya Chou

5 Patents

• US125572152026

  Semiconductor Package Using Flip-chip Technology

  MEDIATEK Inc.

  0 cites
• US119087592024

  Semiconductor Device

  Mediatek Inc.

  0 cites
• US118375522023

  Semiconductor Package with Layer Structures, Antenna Layer and Electronic Component

  Mediatek Inc.

  0 cites
• US117282922023

  Semiconductor Package Assembly Having a Conductive Electromagnetic Shield Layer

  Mediatek Inc.

  0 cites
• US117218822023

  Semiconductor Package Having Discrete Antenna Device

  Mediatek Inc.

  0 cites