Che-jung Chu

3 Patents

• US121837092024

  Chip Package Structure with Ring-like Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US118483022023

  Chip Package Structure with Ring-like Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US115454632023

  Chip Package Structure with Ring-like Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites