Chaung-lin Lai

3 Patents

• US122727122025

  Chip Package and Method for Forming a Chip Package Having First and Second Stack of Dummy Metal Layers Surround the Sensing Region

  Xintec Inc.

  0 cites
• US122373542025

  Chip Package and Method for Forming the Same

  Xintec Inc.

  0 cites
• US117460032023

  Chip Package

  XINTEC Inc.

  0 cites