7 Patents
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- US121762222024Semiconductor Package with Metal Posts from Structured Leadframe
Infineon Technologies AG
0 cites - US120210002024Semiconductor Package and Method for Fabricating a Semiconductor Package
Infineon Technologies AG
0 cites - US117911692023Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package
INFINEON TECHNOLOGIES AG
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- US115691962023Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package
Infineon Technologies AG
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