Charlotte Emnet

4 Patents

• US126069252026

  Composition for Copper Bump Electrodeposition Comprising a Leveling Agent

  BASF SE

  0 cites
• US121348342024

  Composition for Copper Bump Electrodeposition Comprising a Polyaminoamide Type Leveling Agent

  BASF SE

  0 cites
• US120984732024

  Composition for Cobalt Plating Comprising Additive for Void-free Submicron Feature Filling

  BASF SE

  0 cites
• US119269182024

  Composition for Metal Plating Comprising Suppressing Agent for Void Free Filing

  BASF SE

  0 cites