6 Patents
- US126160432026Package Comprising Integrated Devices with Inner and Outer Solder Interconnects
QUALCOMM INCORPORATED
0 cites - US125124012025Integrated Device Substrate Including Embedded Electromagnetic Isolation Structure
QUALCOMM INCORPORATED
0 cites - US122438552025Package Comprising Channel Interconnects Located Between Solder Interconnects
QUALCOMM INCORPORATED
0 cites - US121609522024Providing a Lower Inductance Path in a Routing Substrate for a Capacitor, and Related Electronic Devices and Fabrication Methods
QUALCOMM INCORPORATED
0 cites - US117841572023Package Comprising Integrated Devices Coupled Through a Metallization Layer
QUALCOMM INCORPORATED
0 cites - US116055942023Package Comprising a Substrate and a High-density Interconnect Integrated Device Coupled to the Substrate
QUALCOMM INCORPORATED
0 cites