7 Patents
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- US125291352026Methods of Modifying Openings in Hardmasks and Photoresists to Achieve Desired Critical Dimensions
Applied Materials, Inc.
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- US122550672025Method for Depositing Layers Directly Adjacent Uncovered Vias or Contact Holes
Applied Materials, Inc.
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- US121632232024Process for the Production of a Molecular Layer and Electronic Component Comprising Same
MERCK PATENT GmbH
0 cites - US120355462024Method for Producing an Electronic Component Which Includes a Self-assembled Monolayer
MERCK PATENT GmbH
0 cites