12 Patents
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- US123459322025Die Last and Waveguide Last Architecture for Silicon Photonic Packaging
Intel Corporation
0 cites - US123411172025Methods and Apparatus to Reduce Defects in Interconnects Between Semiconductor Dies and Package Substrates
Intel Corporation
0 cites - US122985722025Device, Method and System for Optical Communication with a Photonic Integrated Circuit Chip and a Transverse Oriented Lens Structure
Intel Corporation
0 cites - US121641472024Device, Method and System for Optical Communication with a Waveguide Structure and an Integrated Optical Coupler of a Photonic Integrated Circuit Chip
Intel Corporation
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- US116447572023Method to Achieve Tilted Patterning with a Through Resist Thickness Using Projection Optics
Intel Corporation
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