Changeun Joo

7 Patents

• US125388032026

  Semiconductor Package Including a Barrier Structure Covering Connection Pads and Contacting a Protruding Portion of an Adhesive Layer

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US119904392024

  Semiconductor Package Including Under Bump Metallization Pad

  Samsung Electronics Co., Ltd.

  0 cites
• US119786962024

  Semiconductor Package Device

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US119729662024

  Method of Manufacturing a Semiconductor Package Including Correcting Alignment Error While Forming Redistribution Wiring Struture

  Samsung Electronics Co., Ltd.

  0 cites
• US119618122024

  Semiconductor Packages Having Vias

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118108642023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US115878982023

  Semiconductor Packages Having Vias

  Samsung Electronics Co., Ltd.

  0 cites