Chang Suk Lee

6 Patents

• US124103412025

  Adhesive Composition, and Method for Preparing Same

  CJ CHEILJEDANG CORPORATION

  0 cites
• US122276762025

  Adhesive Composition and Preparation Method Thereof

  CJ CHEILJEDANG CORPORATION

  0 cites
• US121104302024

  Adhesive Composition, and Production Method Thereof

  CJ CHEILJEDANG CORPORATION

  0 cites
• US121104312024

  Adhesive Composition and Preparation Method Therefor

  CJ CHEILJEDANG CORPORATION

  0 cites
• US120776812024

  CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same

  SAMSUNG SDI CO., Ltd.

  0 cites
• US120180472024

  Method for Producing N-acetyl Dipeptide and N-acetyl Amino Acid

  CJ CHEILJEDANG CORPORATION

  0 cites