Patents/Inventors

Chang-fu Lin

TaichungTW14 patents

16 Patents

US124009312025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US122781892025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US122551652025
Electronic Package and Carrier Thereof and Method for Manufacturing the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US122551822025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121763272024
Method for Fabricating Electronic Package
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US121006422024
Electronic Package and Fabrication Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US120806182024
Electronic Package, Heat Dissipation Structure and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US120274842024
Electronic Package and Carrier Thereof and Method for Manufacturing the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
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US119843792024
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US119730142024
Method of Manufacturing Substrate Structure with Filling Material Formed in Concave Portion
Siliconware Precision Industries Co., Ltd.
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US118108622023
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US117929382023
Method for Fabricating Carrier Structure
Silicon Precision Industries Co., Ltd.
0 cites
US117641882023
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US117422962023
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US116769482023
Method for Fabricating Electronic Package
Siliconware Precision Industries Co., Ltd.
0 cites
US116055542023
Flip-chip Process and Bonding Equipment
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites