Chang-chen Tsao

4 Patents

• US125435262026

  Fully Automated Wafer Debonding System and Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US122117272025

  Simultaneous Bonding Approach for High Quality Wafer Stacking

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116705242023

  Fully Automated Wafer Debonding System and Method Thereof

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US116211862023

  Simultaneous Bonding Approach for High Quality Wafer Stacking Applications

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites