9 Patents
- US125641062026Techniques for Joining Dissimilar Materials in Microelectronics
Adeia Semiconductor Bonding Technologies Inc.
0 cites - US124381222025DBI to Si Bonding for Simplified Handle Wafer
Adeia Semiconductor Bonding Technologies Inc.
0 cites - 0 cites
- US123811732025Direct Hybrid Bonding of Substrates Having Microelectronic Components with Different Profiles And/or Pitches at the Bonding Interface
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites - US123006622025DBI to SI Bonding for Simplified Handle Wafer
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites - 0 cites
- US117913072023DBI to SI Bonding for Simplified Handle Wafer
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites - US116643572023Techniques for Joining Dissimilar Materials in Microelectronics
Adeia Semiconductor Bonding Technologies Inc.
0 cites - US115520412023Chemical Mechanical Polishing for Hybrid Bonding
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites