18 Patents
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- US123410802025Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US122059152025Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
0 cites - 0 cites
- US120210162024Thermally Enhanced Silicon Back End Layers for Improved Thermal Performance
Intel Corporation
0 cites - US119786892024Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - 0 cites
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- US118375192023Heatsink Cutout and Insulating Through Silicon Vias to Cut Thermal Cross-talk
Intel Corporation
0 cites - 0 cites
- US117568602023Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US117355522023Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
0 cites - US117054172023Backside Metallization (BSM) on Stacked Die Packages and External Silicon at Wafer Level, Singulated Die Level, or Stacked Dies Level
Intel Corporation
0 cites - US116949422023Annular Silicon-embedded Thermoelectric Cooling Devices for Localized On-die Thermal Management
Intel Corporation
0 cites - US1167056120233D Buildup of Thermally Conductive Layers to Resolve Die Height Differences
Intel Corporation
0 cites - US116642932023Solid State Thermoelectric Cooler in Silicon Backend Layers for Fast Cooling in Turbo Scenarios
Intel Corporation
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