25 Patents
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- US122057722025Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US121365232024Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US119292002024Coil Component and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US118759482024Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US117639862023Electronic Component Including Insulating Layer Between Body and Shielding Layer
Samsung Electro-mechanics Co., Ltd.
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- US115943752023Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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