Patents/Inventors

Chan Lam Cha

MelakaMY2 patents

3 Patents

US123005592025
Semiconductor Packages and Methods for Manufacturing Thereof
Infineon Technologies AG
0 cites
US122781712025
Chip Package and Method of Forming a Chip Package
Infineon Technologies AG
0 cites
US121762222024
Semiconductor Package with Metal Posts from Structured Leadframe
Infineon Technologies AG
0 cites