Patents/Inventors

Chan H. Yoo

Boise, IDUS28 patents

30 Patents

US125432612026
Solder Mask Fault Fiber Optics Sensor
Micron Technology, Inc.
0 cites
US124008772025
Semiconductor Devices with Flexible Reinforcement Structure
Micron Technology, Inc.
0 cites
US122770562025
Memory Device Interface and Method
Micron Technology, Inc.
0 cites
US122539432025
Memory Device Interface and Method
0 cites
US122438012025
Substrates for Semiconductor Device Assemblies and Systems with Improved Thermal Performance and Methods for Making the Same
Micron Technology, Inc.
0 cites
US122305832025
Interposers for Microelectronic Devices
Micron Technology, Inc.
0 cites
US122181012025
Three-dimensional Stacking Semiconductor Assemblies and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US122181192025
Stacked Interposer Structures
Micron Technology, Inc.
0 cites
US122118142025
Semiconductor Interconnect Structures with Conductive Elements, and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US121990012025
Semiconductor Assemblies Including Vertically Integrated Circuits and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US121990682025
Methods of Forming Microelectronic Device Assemblies and Packages
Micron Technology, Inc.
0 cites
US121702752024
Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer
Micron Technology, Inc.
0 cites
US121128302024
Methods for Memory Power Management and Memory Devices and Systems Employing the Same
0 cites
US120626072024
Low Cost Three-dimensional Stacking Semiconductor Assemblies
Micron Technology, Inc.
0 cites
US119903502024
Semiconductor Devices with Flexible Reinforcement Structure
Micron Technology, Inc.
0 cites
US119293492024
Semiconductor Device Having Laterally Offset Stacked Semiconductor Dies
Micron Technology, Inc.
0 cites
US118879202024
Redistribution Layers Including Reinforcement Structures and Related Semiconductor Device Packages, Systems and Methods
Micron Technology, Inc.
0 cites
US118682532024
Memory Device Interface and Method
0 cites
US118240102023
Interposers for Microelectronic Devices
Micron Technology, Inc.
0 cites
US117898902023
Memory Devices, Modules and Systems Having Memory Devices with Varying Physical Dimensions, Memory Formats, and Operational Capabilities
0 cites
US117913152023
Semiconductor Assemblies Including Thermal Circuits and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US117841662023
Dual Sided Fan-out Package Having Low Warpage Across All Temperatures
Micron Technology, Inc.
0 cites
US117283072023
Semiconductor Interconnect Structures with Conductive Elements, and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US117217422023
Memory Modules and Memory Packages Including Graphene Layers for Thermal Management
Micron Technology, Inc.
0 cites
US116886582023
Semiconductor Device
Micron Technology, Inc.
0 cites
US116642912023
Semiconductor Assemblies Including Vertically Integrated Circuits and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US115894802023
Tubular Heat Spreaders for Memory Modules and Memory Modules Incorporating the Same
Micron Technology, Inc.
0 cites
US115812312023
Stress Tuned Stiffeners for Micro Electronics Package Warpage Control
Micron Technology, Inc.
0 cites
US115748202023
Semiconductor Devices with Flexible Reinforcement Structure
Micron Technology, Inc.
0 cites
US115575262023
Substrates for Semiconductor Device Assemblies and Systems with Improved Thermal Performance and Methods for Making the Same
Micron Technology, Inc.
0 cites