16 Patents
- US125819312026Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
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- US119424462024Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US118879132024Integrated Circuit Device and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
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- US118240762023Semiconductor Package Including an Image Sensor Chip and a Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US115454172023Integrated Circuit Device and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites - US115455122023Image Sensor Package with Underfill and Image Sensor Module Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
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