Catharina Wille

5 Patents

• US123478052025

  Inkjet Printing of Diffusion Solder

  Infineon Technologies Austria AG

  0 cites
• US123302432025

  Method of Forming an Intermetallic Phase Layer with a Plurality of Nickel Particles

  Infineon Technologies AG

  0 cites
• US120237622024

  Layer Structure with an Intermetallic Phase Layer and a Chip Package That Includes the Layer Structure

  Infineon Technologies AG

  0 cites
• US117769272023

  Semiconductor Device Including a Solder Compound Containing a Compound Sn/sb

  Infineon Technologies AG

  0 cites
• US115520422023

  Solder Material with Two Different Size Nickel Particles

  Infineon Technologies AG

  0 cites