7 Patents
- 0 cites
- US122551622025Semiconductor Device, Semiconductor Component and Method of Fabricating a Semiconductor Device
Infineon Technologies Austria AG
0 cites - US120948372024Method of Manufacturing Semiconductor Devices by Filling Grooves Formed in a Front Side Surface of a Wafer with a Side Face Protection Material
Infineon Technologies AG
0 cites - US120877172024Semiconductor Package and Methods of Manufacturing a Semiconductor Package
Infineon Technologies Austria AG
0 cites - US118482372023Composite Wafer, Semiconductor Device and Electronic Component
Infineon Technologies AG
0 cites - US117569172023Method for Processing a Semiconductor Wafer, Semiconductor Wafer, Clip and Semiconductor Device
Infineon Technologies Austria AG
0 cites - 0 cites