Patents/Inventors

Byung Woo Kang

Suwon-siKR25 patents

27 Patents

US126146742026
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US125923402026
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US124445382025
Multilayer Electronic Component Having External Electrode Which Includes Resin Layer and Conductive Resin Layer
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US124083482025
Semiconductor Device and Manufacturing Method Thereof
SK Hynix Inc.
0 cites
US123603882025
Camera Module
Samsung Electro-mechanics Co., Ltd.
0 cites
US123603872025
Camera Module
Samsung Electro-mechanics Co., Ltd.
0 cites
US123342682025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122834312025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122664792025
Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US120681102024
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US120258512024
Camera Module
Samsung Electro-mechanics Co., Ltd.
0 cites
US120091542024
Multilayer Electronic Component with Conductive Resin Layer
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US119471322024
Camera Module
Samsung Electro-mechanics Co., Ltd.
0 cites
US119357032024
Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US118745942024
Camera Module
Samsung Electro-mechanics Co., Ltd.
0 cites
US118238442023
Capacitor Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US118172672023
Multilayer Capacitor
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US118172692023
Multilayer Capacitor
Samsung Electro-mechanics Co., Ltd.
0 cites
US118172512023
Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US118043322023
Multilayered Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117987472023
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US116948442023
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US116369842023
Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US115879412023
Method of Planarizing Insulating Layer for Memory Device
SK Hynix Inc.
0 cites
US115749202023
Semiconductor Device and Manufacturing Method of Semiconductor Device
SK Hynix Inc.
0 cites
US115703452023
Camera Module
Samsung Electro-mechanics Co., Ltd.
0 cites
US115628592023
MLCC Module and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites