Patents/Inventors

Byung Ju Choi

DaejeonKR2 patents

3 Patents

US124484902025
Epoxy Resin Composition for Molding Semiconductor, Molding Film and Semiconductor Package Using the Same
LG CHEM, Ltd.
0 cites
US118790752024
Resin Composition for Bonding Semiconductors, Adhesive Film for Semiconductor Using the Same, Dicing Die Bonding Film, and Method for Dicing Semiconductor Wafer
LG CHEM, Ltd.
0 cites
US117025202023
Epoxy Resin Composition for Molding Semiconductor, Molding Film and Semiconductor Package Using the Same
LG CHEM, Ltd.
0 cites