Patents/Inventors

Byung Joon Han

SeoulKR2 patents

2 Patents

US125327922026
Fan-out Packaging Device Using Bridge and Method of Manufacturing Fan-out Packaging Device Using Bridge
0 cites
US124698192025
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
STATS Chippac Pte. Ltd.
0 cites