3 Patents
- US123681312025Embedded Nanoparticles for On-die Thermal Enhancement of Hybrid Bonding and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US123344692025Piezoelectric Materials for On-die Thermal Enhancement of Hybrid Bonding and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US121911642025Hybrid Mold Chase Surface for Semiconductor Bonding and Related Systems and Methods
Micron Technology, Inc.
0 cites