Patents/Inventors

Byung Hak Kim

Gyeonggi-doKR1 patent

2 Patents

US124518622025
Surface Acoustic Wave Wafer Level Packages with Organic Solderability Preservative Coating Layers and Manufacturing Methods Thereof
WISOL CO., Ltd.
0 cites
US116245712023
Frame Assembly for Pistol with Lock Lever
DASAN MACHINERIES CO., Ltd
0 cites