Patents/Inventors

Byoungrim Seo

Hwaseong-siKR2 patents

2 Patents

US120683482024
Image Sensor Package with Transparent Cover Partially Covered by Mold Layer and Manufacturing Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119013852024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO, Ltd.
0 cites