Patents/Inventors

Byoung Jun Ahn

Seongnam-siKR1 patent

2 Patents

US123880052025
Semiconductor Package and Fabricating Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites
US119617972024
Semiconductor Package and Fabricating Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites