Patents/Inventors

Byeung Chul Kim

Boise, IDUS16 patents

13 Patents

US125751022026
Merged Cavities and Buried Etch Stops for Three-dimensional Memory Arrays
Micron Technology, Inc.
0 cites
US125686212026
Memory Apparatus and Methods Including Merged Process for Memory Cell Pillar and Source Structure
Micron Technology, Inc.
0 cites
US125572892026
Electronic Devices Comprising Adjoining Oxide Materials and Related Systems
Micron Technology, Inc.
0 cites
US125435432026
Selective Cavity Merging for Isolation Regions in a Memory Die
Micron Technology, Inc.
0 cites
US124777302025
Electronic Devices Comprising Segmented High-k Dielectric Materials and Storage Node Materials, Related Systems, and Methods of Forming
Micron Technology, Inc.
0 cites
US121564062024
Methods of Forming Integrated Assemblies with Improved Charge Migration Impedance
0 cites
US121503032024
Integrated Assemblies Having Charge-trapping Material Arranged in Vertically-spaced Segments, and Methods of Forming Integrated Assemblies
0 cites
US120824162024
Integrated Assemblies and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites
US120528622024
Microelectronic Devices Including Stack Structures Having Air Gaps, and Related Memory Devices, Electronic Systems, and Methods
Micron Technology, Inc.
0 cites
US116721182023
Electronic Devices Comprising Adjoining Oxide Materials and Related Systems
Micron Technology, Inc.
0 cites
US116316972023
Integrated Assemblies Having Vertically-extending Channel Material with Alternating Regions of Different Dopant Distributions, and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites
US115879482023
Integrated Assemblies Having Vertically-spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites
US115576082023
Integrated Assemblies Having Vertically-spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites