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Inventors
Byeonguk Jeon
Seoul
KR
2 patents
3 Patents
US12362286
2025
Printed Circuit Board and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US12166007
2024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US11810868
2023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites