3 Patents
- US122223622025Method of Measuring Parameters of Plasma, Apparatus for Measuring Parameters of Plasma, Plasma Processing System, and Method of Processing Wafer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122100452025Impedance Measurement Jig and Method of Controlling a Substrate-processing Apparatus Using the Jig
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119843442024Lift Apparatus and Substrate Processing Apparatus Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites