Patents/Inventors

Byeong Yeon Choi

Gyeonggi-doKR1 patent

2 Patents

US122758672025
Adhesive Tape for Semiconductor Package Manufacturing Process and Method for Manufacturing Same
MODU TECH CO., Ltd.
0 cites
US122215692025
Adhesive Tape for Semiconductor Package Manufacturing Process, and Method for Manufacturing Same
MODU TECH CO., Ltd.
0 cites