Bryan Black

3 Patents

• US125688322026

  Through Package Vertical Interconnect and Method of Making Same

  Chipletz, Inc.

  0 cites
• US120948532024

  Semiconductor Chip with Redundant Thru-silicon-vias

  ATI TECHNOLOGIES ULC

  0 cites
• US116024062023

  System and Method for Rapidly Accessing an Improved Tourniquet

  0 cites