Patents/Inventors

Brigham Navaja

San Diego, CAUS4 patents

4 Patents

US125435992026
Package Comprising a First Substrate, a Second Substrate and an Electrical Device Coupled to a Bottom Surface of the Second Substrate
QUALCOMM INCORPORATED
0 cites
US119488772024
Hybrid Package Apparatus and Method of Fabricating
QUALCOMM INCORPORATED
0 cites
US115812622023
Package Comprising a Die and Die Side Redistribution Layers (RDL)
QUALCOMM INCORPORATED
0 cites
US115520232023
Passive Component Embedded in an Embedded Trace Substrate (ETS)
QUALCOMM Incorporated
0 cites