Patents/Inventors

Brian J. Brown

Palo Alto, CAUS24 patents

24 Patents

US126058022026
Condensed Gas Pad Conditioner
Applied Materials, Inc.
0 cites
US125764752026
Determining the Orientation of a Substrate In-situ
Applied Materials, Inc.
0 cites
US124343472025
Method for CMP Temperature Control
Applied Materials, Inc.
0 cites
US124008812025
Apparatus and Method of Substrate Edge Cleaning and Substrate Carrier Head Gap Cleaning
Applied Materials, Inc.
0 cites
US123438402025
Control of Processing Parameters for Substrate Polishing with Substrate Precession
Applied Materials, Inc.
0 cites
US122964272025
Apparatus and Method for CMP Temperature Control
Applied Materials, Inc.
0 cites
US122858382025
Wafer Edge Asymmetry Correction Using Groove in Polishing Pad
Applied Materials, Inc.
0 cites
US122241862025
Apparatus and Method of Brush Cleaning Using Periodic Chemical Treatments
Applied Materials, Inc.
0 cites
US121945912025
Roller for Location-specific Wafer Polishing
Applied Materials, Inc.
0 cites
US121989442025
Substrate Handling in a Modular Polishing System with Single Substrate Cleaning Chambers
Applied Materials, Inc.
0 cites
US121387332024
Roller for Location-specific Wafer Polishing
Applied Materials, Inc.
0 cites
US120515992024
Cleaning Method with In-line SPM Processing
Applied Materials, Inc.
0 cites
US120301562024
Polishing Carrier Head with Piezoelectric Pressure Control
Applied Materials, Inc.
0 cites
US120273822024
Surface Cleaning with Directed High Pressure Chemistry
Applied Materials, Inc.
0 cites
US119515892024
Wafer Edge Asymmetry Correction Using Groove in Polishing Pad
Applied Materials, Inc.
0 cites
US119318532024
Control of Processing Parameters for Substrate Polishing with Angularly Distributed Zones Using Cost Function
Applied Materials, Inc.
0 cites
US119318542024
Chemical Mechanical Polishing Using Time Share Control
Applied Materials, Inc.
0 cites
US118970792024
Low-temperature Metal CMP for Minimizing Dishing and Corrosion, and Improving Pad Asperity
Applied Materials, Inc.
0 cites
US118907152024
Polishing Carrier Head with Piezoelectric Pressure Control
Applied Materials, Inc.
0 cites
US118839232024
Chemical Mechanical Polishing Using Time Share Control
Applied Materials, Inc.
0 cites
US118268722023
Temperature and Slurry Flow Rate Control in CMP
Applied Materials, Inc.
0 cites
US118239162023
Apparatus and Method of Substrate Edge Cleaning and Substrate Carrier Head Gap Cleaning
Applied Materials, Inc.
0 cites
US117640692023
Asymmetry Correction via Variable Relative Velocity of a Wafer
Applied Materials, Inc.
0 cites
US116825672023
Cleaning System with In-line SPM Processing
Applied Materials, Inc.
0 cites