Bret W. Simon

4 Patents

• US119488552024

  Integrated Circuit (IC) Package with Cantilever Multi-chip Module (MCM) Heat Spreader

  Rockwell Collins, Inc.

  0 cites
• US116372112023

  Optically Clear Thermal Spreader for Status Indication Within an Electronics Package

  Rockwell Collins, Inc.

  0 cites
• US116212192023

  Method and Apparatus for Through Silicon Die Level Interconnect

  Rockwell Collins, Inc.

  0 cites
• US116055702023

  Reconstituted Wafer Including Integrated Circuit Die Mechanically Interlocked with Mold Material

  Rockwell Collins, Inc.

  0 cites