Patents/Inventors

Brent Dae Hermsmeier

Santa Clara, CAUS1 patent

2 Patents

US123879572025
Rigid Carrier Assemblies with Tacky Media Molded Thereon
Daewon Semiconductor Packaging Industrial Company
0 cites
US121548052024
Patterned Carrier Assemblies Having an Integrated Adhesive Film
Daewon Semiconductor Packaging Industrial Company
0 cites