31 Patents
- US125989702026Top via on Subtractively Etched Conductive Line
INTERNATIONAL BUSINESS MACHINES CORPORATION
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- US124827462025Early Backside First Power Delivery Network
International Business Machines Corporation
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- US123566852025Looped Long Channel Field-effect Transistor
International Business Machines Corporation
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- US121366552024Backside Electrical Contacts to Buried Power Rails
International Business Machines Corporation
0 cites - US120573712024Semiconductor Device with Early Buried Power Rail (BPR) and Backside Power Distribution Network (BSPDN)
International Business Machines Corporation
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- US120017722024Ultra-short-height Standard Cell Architecture
International Business Machines Corporation
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- US119904102024Top via Interconnect Having a Line with a Reduced Bottom Dimension
INTERNATIONAL BUSINESS MACHINES CORPORATION
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- US119014402024Sacrificial Fin for Self-aligned Contact Rail Formation
International Business Machines Corporation
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- US118551912023Vertical FET with Contact to Gate Above Active Fin
International Business Machines Corporation
0 cites - US118429612023Advanced Metal Interconnects with a Replacement Metal
International Business Machines Corporation
0 cites - US118307742023Buried Contact Through Fin-to-fin Space for Vertical Transport Field Effect Transistor
International Business Machines Corporation
0 cites - US118239982023Top via with Next Level Line Selective Growth
International Business Machines Corporation
0 cites - US118044062023Top via Cut Fill Process for Line Extension Reduction
International Business Machines Corporation
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- US116581162023Interconnects on Multiple Sides of a Semiconductor Structure
International Business Machines Corporation
0 cites - US115630032023Fin Top Hard Mask Formation After Wafer Flipping Process
International Business Machines Corporation
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