10 Patents
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- US124446722025Hybrid Bonding Technologies with Thermal Expansion Compensation Structures
Intel Corporation
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- US122551472025Electronic Substrate Having an Embedded Etch Stop to Control Cavity Depth in Glass Layers Therein
Intel Corporation
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- US120741022024Structural Elements for Application Specific Electronic Device Packages
Intel Corporation
0 cites - US120339302024Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites - 0 cites