Bradley R. Bitz

6 Patents

• US125640512026

  Heat Spreader Apparatus with Magnetic Attachments on Printed Wiring Board Assemblies, Related Methods and Electronic Systems

  Micron Technology, Inc.

  0 cites
• US125436072026

  Separation Method and Assembly for Chip-on-wafer Processing

  Micron Technology, Inc.

  0 cites
• US122074112025

  Printed Wiring Boards, Printed Wiring Board Assemblies, and Electronic Systems

  Micron Technology, Inc.

  0 cites
• US117496662023

  Semiconductor Die Assemblies Having Molded Underfill Structures and Related Technology

  Micron Technology, Inc.

  0 cites
• US116886642023

  Semiconductor Device Assembly with Through-mold Cooling Channel Formed in Encapsulant

  Micron Technology, Inc.

  0 cites
• US116769552023

  Separation Method and Assembly for Chip-on-wafer Processing

  Micron Technology, Inc.

  0 cites