Brad Eaton

3 Patents

• US122576592025

  Waste Collection and Abatement During Hybrid Additive and Subtractive Manufacturing

  MANTLE Inc.

  0 cites
• US121319522024

  Wafer Dicing Using Femtosecond-based Laser and Plasma Etch

  Applied Materials, Inc.

  0 cites
• US116211942023

  Wafer Dicing Using Femtosecond-based Laser and Plasma Etch

  Applied Materials, Inc.

  0 cites