15 Patents
- US126000082026Substrate Polishing Apparatus and Method of Polishing Substrate Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US125987512026Semiconductor Devices and Data Storage Systems Including the Same
Samsung Electronics Co., Ltd.
0 cites - US125816572026Semiconductor Devices and Data Storage Systems Including the Same
Samsung Electronics Co., Ltd.
0 cites - US125519822026Polishing Pad and Substrate Processing Apparatus Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US125139822025Semiconductor Device Having an Isolation Structure Between Adjacent Source/drain Regions
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US124647952025Method of Manufacturing Semiconductor Device Using Single Slurry Chemical Mechanical Polishing (CMP) Process
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US123946912025Semiconductor Devices and Data Storage Systems Including the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US122074572025Semiconductor Devices and Methods of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119105942024Semiconductor Devices and Methods of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
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