4 Patents
- US124461582025Circuit Modules with Encapsulant-embedded Leadframe Terminals, and Methods of Fabricating Such Circuit Modules
NXP USA, Inc.
0 cites - US124153052025Conduit Inserts for Encapsulant Compound Formulation Kneading and Encapsulation Back-end Assembly Processes
NXP USA, Inc.
0 cites - US117870972023Conduit Inserts for Encapsulant Compound Formulation Kneading and Encapsulation Back-end Assembly Processes
NXP USA, Inc.
0 cites - US115812412023Circuit Modules with Front-side Interposer Terminals and Through-module Thermal Dissipation Structures
NXP USA, Inc.
0 cites