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Inventors
Boon Ping Koh
Seberang Jaya
MY
9 patents
8 Patents
US12581611
2026
Methods and Apparatus to Cool Electronic Devices
Intel Corporation
0 cites
US12471262
2025
Radiation Shield with Radiation Shield Gap
Intel Corporation
0 cites
US12424779
2025
Flexible Printed Circuit Board Arrangement
Intel Corporation
0 cites
US12309984
2025
Radiation Shield and Groove in Support Structure
Intel Corporation
0 cites
US12250800
2025
Radiation Shield with Zipper
Intel Corporation
0 cites
US11658127
2023
RFI Free Picture Frame Metal Stiffener
Intel Corporation
0 cites
US11652057
2023
Disaggregated Die Interconnection with On-silicon Cavity Bridge
Intel Corporation
0 cites
US11552403
2023
Slot Antenna on a Printed Circuit Board (PCB)
Intel Corporation
0 cites