Patents/Inventors

Bongsub Lee

Santa Clara, CAUS10 patents

9 Patents

US125450102026
Directly Bonded Metal Structures Having Oxide Layers Therein
Adeia Semiconductor Bonding Technologies Inc.
0 cites
US125124252025
Expansion Controlled Structure for Direct Bonding and Method of Forming Same
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US124827762025
Metal Pads Over TSV
Adeia Semiconductor Bonding Technologies Inc.
0 cites
US122438512025
Offset Pads Over TSV
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US122059262025
TSV as Pad
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US119553932024
Structures for Bonding Elements Including Conductive Interface Features
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US119554452024
Metal Pads Over TSV
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US117496452023
TSV as Pad
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US117283132023
Offset Pads Over TSV
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites