Patents/Inventors

Bongju Cho

Hwaseong-siKR14 patents

14 Patents

US125936842026
Semiconductor Package Including Heat Dissipation Structure
Samsung Electronics Co., Ltd.
0 cites
US123947082025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122781912025
Semiconductor Packages Having Wiring Patterns
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122611052025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121193052024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120573802024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120465622024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120210202024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US119358472024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118375372023
Fan-out Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117216202023
Fan-out Type Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691582023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691752023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US115629662023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites