4 Patents
- US123477952025Semiconductor Package Including Uneven Structures and Electronic Device Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122835762025Electronic Device Including Thermal Interface Material Layer and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US116502372023Method of Manufacturing an Integrated Circuit Involving Performing an Electrostatic Discharge Test and Electrostatic Discharge Test System Performing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites