10 Patents
- US126222382026Device and Method for Fabricating a Patterned FD-SOI Wafer Including Exposed Buried Oxide
Microchip Technology Incorporated
0 cites - US124245022025Integrated Circuit Package with Heat Transfer Chimney Including Thermally Conductive Nanoparticles
Microchip Technology Incorporated
0 cites - 0 cites
- US122059102025Integrated Circuit Bond Pad with Multi-material Toothed Structure
Microchip Technology Incorporated
0 cites - US120402822024Electronic Device Including Interposers Bonded to Each Other
Microchip Technology Incorporated
0 cites - US119358242024Integrated Circuit Package Module Including a Bonding System
Microchip Technology Incorporated
0 cites - 0 cites
- US117232222023Integrated Circuit (IC) Package with Integrated Inductor Having Core Magnetic Field (B Field) Extending Parallel to Substrate
Microchip Technology Incorporated
0 cites - US116826412023Integrated Circuit Bond Pad with Multi-material Toothed Structure
Microchip Technology Incorporated
0 cites - US116826422023Integrated Circuit (IC) Device Including a Force Mitigation System for Reducing Under-pad Damage Caused by Wire Bond
Microchip Technology Incorporated
0 cites